{"schema":"hottub-news/list/v1","item_schema":"hottub-news/item/v1","count":2,"sponsored":0,"items":[{"id":"n_vqv4owpixskcrsm4cvpq","seq":1259918,"kind":"article","title":"應材與貝思半導體擴大合作 開發新一代AI晶片封裝技術","title_en":"Yingcai and Best Semiconductor expand cooperation to develop next-generation AI chip packaging technology","url":"https://news.cnyes.com/news/id/6620234","summary":"應用材料(AMAT-US)今(2)日宣布與貝思半導體擴大長期策略合作關係，貝思半導體加入應材設備與製程創新暨商業化(EPIC)中心成為創新合作夥伴。此次合作延續雙方自 2020 年啟動的聯合開發計畫，並將協同創新的範疇從混合鍵合進一步延伸至新的互連架構與應用，以支援半導體產業因應 AI 發展所需的技","published":"2026-10-02T03:03:49Z","seen":"2026-10-02T04:02:22Z","lang":"zh","country":"TW","source":{"id":"kite-news-cnyes-com-887ba2","name":"news.cnyes.com","domain":"news.cnyes.com"},"via":"kite-news-cnyes-com-887ba2","topics":["美股雷達"],"authors":["鉅亨網記者魏志豪 台北"],"entities":[{"id":"Q45477654","name":"Zhuang Nanjie","type":"org"}],"image":"https://cimg.cnyes.cool/static/rss/default/m/03.jpg","story":"st_snnu3gevkqlnkyivahiq","category":"science-technology","category_p":0.91,"sentiment":"positive","tone":0.53,"political":0.03},{"id":"n_id2holsdc76ghptawecq","seq":851277,"kind":"article","title":"應材攜手鎧俠 共同推進新一代記憶體技術發展","title_en":"Yingcai partners with Qixia to jointly promote the development of next-generation memory technology.","url":"https://news.cnyes.com/news/id/6618648","summary":"應材宣布鎧俠將加入矽谷EPIC中心，成為共同推進新一代記憶體技術的創新夥伴。 雙方將在EPIC合作開發先進記憶體單元、多晶片堆疊架構、先進封裝與材料工程。 合作目標是提升AI時代記憶體密度、頻寬與能源效率，加速技術突破商業化。","published":"2026-09-30T07:21:35Z","seen":"2026-09-30T08:02:58Z","lang":"zh","country":"TW","source":{"id":"kite-news-cnyes-com-887ba2","name":"news.cnyes.com","domain":"news.cnyes.com"},"via":"kite-news-cnyes-com-887ba2","topics":["美股雷達"],"authors":["鉅亨網記者魏志豪 台北"],"entities":[{"id":"Q45477654","name":"Zhuang Nanjie","type":"org"},{"id":"Q1359073","name":"Qixia","type":"org"}],"image":"https://cimg.cnyes.cool/static/rss/default/m/04.jpg","story":"st_oagmwqyeey3ur5iwmxta","category":"science-technology","category_p":0.8,"sentiment":"positive","tone":0.57,"political":0.03}]}