{"schema":"hottub-news/story/v1","story":"st_lsx36kfl2mfsmiovpbaq","title":"高通正评估三星 2nm 工艺，考虑用于下一代移动芯片","title_en":"Qualcomm evaluating Samsung's 2nm process, considering for next-generation mobile chips","outlets":1,"brief":null,"page":"https://hottub.news/stories/qualcomm-evaluating-samsungs-2nm-process-considering-for-next-lsx36kfl2m","count":1,"items":[{"id":"n_lsx36kfl2mfsmiovpbaq","seq":403863,"kind":"article","title":"高通正评估三星 2nm 工艺，考虑用于下一代移动芯片","title_en":"Qualcomm evaluating Samsung's 2nm process, considering for next-generation mobile chips","url":"https://www.ithome.com/1/007/972.htm","summary":"IT之家 9 月 28 日消息，据 ZDNET Korea 昨天报道，高通正在评估三星电子 2nm 晶圆代工工艺，并考虑将其应用于下一代移动芯片。 高通高级副总裁克里斯 · 帕特里克在 2026 骁龙峰会表示，三星电子是高通的重要合作伙伴，双方正深入研究如何将 2nm 技术应用于下一代产品。 据悉，高通当前仍在初步评估和审查三星 2nm 工艺，主要是了解三星代工 2nm 工艺的能力，并评估其应用于下一代移动芯片的潜力。 据IT之家了解，三星电子上一次代工高通骁龙芯片是在 2021 年（8 Gen 1），在此之前还有 声名远扬 的骁龙 888。不过自 2022 年起，高通骁龙芯片一直是由台积电代工。","published":"2026-09-28T10:24:29Z","seen":"2026-09-28T10:47:55Z","lang":"zh","country":"CN","source":{"id":"kite-ithome-com-f1cdd0","name":"ithome.com","domain":"ithome.com","outlet":{"wikidata":"Q28413779","name":"IThome","type":"website","country":"CN","designations":["website"]}},"via":"kite-ithome-com-f1cdd0","entities":[{"id":"Q544847","name":"Qualcomm","type":"org"},{"id":"Q124989916","name":"Samsung","type":"org"}],"story":"st_lsx36kfl2mfsmiovpbaq","category":"science-technology","category_p":0.7400000095367432,"sentiment":"neutral","tone":0.0,"political":0.10000000149011612}]}