{"schema":"hottub-news/story/v1","story":"st_p5ghkaubfrxycnytf4pa","title":"三星电机宣布 6.78 万亿韩元投资，提升 AI 服务器用 FCBGA 半导体基板产能","title_en":"Samsung Electro-Mechanics announces 6.78 trillion KRW investment to boost production capacity of FCBGA semiconductor substrates for AI servers","outlets":1,"brief":null,"page":"https://hottub.news/stories/samsung-electro-mechanics-announces-6-78-trillion-krw-investment-to-p5ghkaubfr","count":1,"items":[{"id":"n_p5ghkaubfrxycnytf4pa","seq":560052,"kind":"article","title":"三星电机宣布 6.78 万亿韩元投资，提升 AI 服务器用 FCBGA 半导体基板产能","title_en":"Samsung Electro-Mechanics announces 6.78 trillion KRW investment to boost production capacity of FCBGA semiconductor substrates for AI servers","url":"https://www.ithome.com/1/008/110.htm","summary":"IT之家 9 月 29 日消息，三星电机 (Samsung Electro-Mechanics, SEM) 当地时间今日宣布 将在韩国和越南合计投资 6.78 万亿韩元 （IT之家注：现汇率约合 335.95 亿元人民币） ，提升 AI 服务器用 FCBGA 半导体基板产能。 ▲ 世宗生产基地新工厂建设模拟图 三星电机计划在韩国世宗生产基地投资 4.27 万亿韩元 （现汇率约合 211.58 亿元人民币） ，这也是其单一产品投资史上最大规模，投资期为 2026 年 9 月至 2028 年 5 月。这里将作为应对高附加值、高难度产品量产的核心据点，率先响应 AI 服务器基板需求增长。 另一方面，三星电机还将通过越南子公司投资 2.51 万亿韩元 （现汇率约合 124.37 亿元人民币） ，目标 2030 年 6 月完工并投产。其越南子公司将作为通过稳定供应体系应对全球订单及提升生产效率的战略据点进行运营。此次扩产投资将应对全球客户中长期订单扩大的需求，进一步提升生产效率和供应稳定性。 三星电机计划通过此次投资积极应对以 AI…","published":"2026-09-29T01:31:59Z","seen":"2026-09-29T02:07:36Z","lang":"zh","country":"CN","source":{"id":"kite-ithome-com-f1cdd0","name":"ithome.com","domain":"ithome.com","outlet":{"wikidata":"Q28413779","name":"IThome","type":"website","country":"CN","designations":["website"]}},"via":"kite-ithome-com-f1cdd0","entities":[{"id":"Q627018","name":"Samsung Electro-Mechanics","type":"org"}],"story":"st_p5ghkaubfrxycnytf4pa","category":"economy-business","category_p":0.7799999713897705,"category2":"science-technology","sentiment":"positive","tone":0.49000000953674316,"political":0.12999999523162842}]}