{"schema":"hottub-news/story/v1","story":"st_snnu3gevkqlnkyivahiq","title":"應材與貝思半導體擴大合作 開發新一代AI晶片封裝技術","title_en":"Yingcai and Best Semiconductor expand cooperation to develop next-generation AI chip packaging technology","outlets":2,"brief":null,"page":"https://hottub.news/stories/ying-cai-and-best-expand-cooperation-focusing-on-3d-ic-expansion-logic-snnu3gevkq","count":2,"items":[{"id":"n_vqv4owpixskcrsm4cvpq","seq":1259918,"kind":"article","title":"應材與貝思半導體擴大合作 開發新一代AI晶片封裝技術","title_en":"Yingcai and Best Semiconductor expand cooperation to develop next-generation AI chip packaging technology","url":"https://news.cnyes.com/news/id/6620234","summary":"應用材料(AMAT-US)今(2)日宣布與貝思半導體擴大長期策略合作關係，貝思半導體加入應材設備與製程創新暨商業化(EPIC)中心成為創新合作夥伴。此次合作延續雙方自 2020 年啟動的聯合開發計畫，並將協同創新的範疇從混合鍵合進一步延伸至新的互連架構與應用，以支援半導體產業因應 AI 發展所需的技","published":"2026-10-02T03:03:49Z","seen":"2026-10-02T04:02:22Z","lang":"zh","country":"TW","source":{"id":"kite-news-cnyes-com-887ba2","name":"news.cnyes.com","domain":"news.cnyes.com"},"via":"kite-news-cnyes-com-887ba2","topics":["美股雷達"],"authors":["鉅亨網記者魏志豪 台北"],"entities":[{"id":"Q45477654","name":"Zhuang Nanjie","type":"org"}],"image":"https://cimg.cnyes.cool/static/rss/default/m/03.jpg","story":"st_snnu3gevkqlnkyivahiq","category":"science-technology","category_p":0.9100000262260437,"sentiment":"positive","tone":0.5299999713897705,"political":0.029999999329447746},{"id":"n_snnu3gevkqlnkyivahiq","seq":1254393,"kind":"article","title":"應材與貝思擴大合作，聚焦3D IC擴展、邏輯與記憶體整合及光子應用","title_en":"Ying Cai and Best expand cooperation, focusing on 3D IC expansion, logic and memory integration and photonic applications","url":"https://tw.stock.yahoo.com/news/%E6%87%89%E6%9D%90%E8%88%87%E8%B2%9D%E6%80%9D%E6%93%B4%E5%A4%A7%E5%90%88%E4%BD%9C-%E8%81%9A%E7%84%A63d-ic%E6%93%B4%E5%B1%95-%E9%82%8F%E8%BC%AF%E8%88%87%E8%A8%98%E6%86%B6%E9%AB%94%E6%95%B4%E5%90%88%E5%8F%8A%E5%85%89%E5%AD%90%E6%87%89%E7%94%A8-024323635.html","summary":"【財訊快報／記者李純君報導】應用材料與貝思半導體（BE Semiconductor Industries N.V., Besi；阿姆斯特丹泛歐交易所代號：BESI）宣布擴大雙方長期策略合作關係，貝思半導體加入應材設備與製程創新暨商業化（Equipment and Process Innovation and Commercialization, EPIC）中心成為創新合作夥伴。貝思半導體是組裝設備製造商，主要聚焦於晶圓級及基板組裝解決方案，此次宣布德擴大合作，將聚焦新一代3D IC擴展、邏輯與記憶體整合，以及支援AI基礎設施...","published":"2026-10-02T02:43:23Z","seen":"2026-10-02T03:02:04Z","lang":"zh","country":"TW","source":{"id":"kite-tw-news-yahoo-com-ae7227","name":"tw.news.yahoo.com","domain":"tw.news.yahoo.com"},"via":"kite-tw-news-yahoo-com-ae7227","entities":[{"id":"Q102403864","name":"Ying Cai","type":"org"},{"id":"Q9816","name":"Best","type":"org"}],"story":"st_snnu3gevkqlnkyivahiq","category":"science-technology","category_p":0.8799999952316284,"sentiment":"neutral","tone":0.41999998688697815,"political":0.029999999329447746}]}