{"schema":"hottub-news/story/v1","story":"st_t4pev4vhbrgybiubhzmq","title":"對台積電下戰書！三星電子：2029年晶圓代工客戶將增至2017年的4倍左右","title_en":"Samsung Electronics declares war on TSMC! Wafer foundry customers to increase to four times the 2017 level by 2029.","outlets":3,"brief":null,"page":"https://hottub.news/stories/samsung-electronics-declares-war-on-tsmc-wafer-foundry-customers-to-t4pev4vhbr","count":3,"items":[{"id":"n_nlitcuy7r4iooroi7yma","seq":651136,"kind":"article","title":"三星晶圆代工：预计 2029 年客户数达 2017 年 5 倍，届时 HPC 贡献过半营收","title_en":"Samsung Foundry: Expected customer count to reach five times 2017 levels by 2029, with HPC contributing over half of revenue","url":"https://www.ithome.com/1/008/402.htm","summary":"IT之家 9 月 29 日消息，据韩联社报道，三星晶圆代工业务高管노미정当地时间今日在“2026 韩国高端周”投资者关系活动上分享了对该业务的展望。 노미정提到，自晶圆代工 2017 年成为独立业务以来， 其客户数量已增长了约 3 倍 ，而到 2029 年有望达到 12 年前的 5 倍。 HPC（高性能计算）对三星晶圆代工业务的贡献已从 2017 年的 5% 增长到现在的 28%，到 2029 年这一比例有望达到 66%， 届时三星晶圆代工超半数的客户与收入均来自 HPC 领域 。 三星电子计划 2028 年量产第三代 2nm 工艺制程 (SF2P+)，2029 年实现 1.4nm 节点 (SF1.4) 量产。该企业计划 2026 年底启动美国得克萨斯州首座晶圆厂运营；第二晶圆厂的建设也将在 2026 年启动，2030 年量产。","published":"2026-09-29T09:48:25Z","seen":"2026-09-29T11:15:54Z","lang":"zh","country":"CN","source":{"id":"kite-ithome-com-f1cdd0","name":"ithome.com","domain":"ithome.com","outlet":{"wikidata":"Q28413779","name":"IThome","type":"website","country":"CN","designations":["website"]}},"via":"kite-ithome-com-f1cdd0","story":"st_t4pev4vhbrgybiubhzmq","category":"economy-business","category_p":0.9200000166893005,"sentiment":"positive","tone":0.550000011920929,"political":0.019999999552965164},{"id":"n_hnkkfht7ejmxlsqhb5la","seq":585358,"kind":"article","title":"三星要搶台積電訂單 ！喊晶圓代工客戶增4倍、HPC營收占比衝66% 高調設2029目標","title_en":"Samsung wants to snatch TSMC orders! Announces wafer foundry customers to increase by 4 times, HPC revenue share to hit 66% Announces 2029 target","url":"https://tw.stock.yahoo.com/news/%E4%B8%89%E6%98%9F%E8%A6%81%E6%90%B6%E5%8F%B0%E7%A9%8D%E9%9B%BB%E8%A8%82%E5%96%AE-%E5%96%8A%E6%99%B6%E5%9C%93%E4%BB%A3%E5%B7%A5%E5%AE%A2%E6%88%B6%E5%A2%9E4%E5%80%8D-hpc%E7%87%9F%E6%94%B6%E5%8D%A0%E6%AF%94%E8%A1%9D66-%E9%AB%98%E8%AA%BF%E8%A8%AD2029%E7%9B%AE%E6%A8%99-053000547.html","summary":"[FTNN新聞網]實習記者林子云／綜合報導三星電子於今（29）日公開晶圓代工事業的發展目標，代工事業部高層盧美貞指出，若以2017年業務獨立成立法人為基準，目...","published":"2026-09-29T05:30:00Z","seen":"2026-09-29T05:36:47Z","lang":"zh","country":"TW","source":{"id":"kite-tw-news-yahoo-com-ae7227","name":"tw.news.yahoo.com","domain":"tw.news.yahoo.com"},"via":"kite-tw-news-yahoo-com-ae7227","entities":[{"id":"Q124989916","name":"Samsung","type":"org"},{"id":"Q713418","name":"TSMC","type":"org"}],"story":"st_t4pev4vhbrgybiubhzmq","category":"economy-business","category_p":0.8999999761581421,"sentiment":"positive","tone":0.4699999988079071,"political":0.10000000149011612},{"id":"n_t4pev4vhbrgybiubhzmq","seq":568959,"kind":"article","title":"對台積電下戰書！三星電子：2029年晶圓代工客戶將增至2017年的4倍左右","title_en":"Samsung Electronics declares war on TSMC! Wafer foundry customers to increase to four times the 2017 level by 2029.","url":"https://news.cnyes.com/news/id/6617586","summary":"三星電子晶圓代工客戶數以2017年獨立法人為基準已增至約3倍，目標2029年達約4倍。 HPC營收比重由2017年5%升至28%，目標2029年衝到66%，客戶將逾半。 三星將把AI加速器、伺服器CPU/GPU與5奈米以下、GAA及先進封裝推向HPC客戶。","published":"2026-09-29T02:55:32Z","seen":"2026-09-29T03:32:11Z","lang":"zh","country":"TW","source":{"id":"kite-news-cnyes-com-887ba2","name":"news.cnyes.com","domain":"news.cnyes.com"},"via":"kite-news-cnyes-com-887ba2","topics":["歐亞股"],"authors":["鉅亨網編譯陳韋廷"],"entities":[{"id":"Q20718","name":"Samsung Electronics","type":"org"},{"id":"Q713418","name":"TSMC","type":"org"}],"image":"https://cimg.cnyes.cool/static/rss/default/m/05.jpg","story":"st_t4pev4vhbrgybiubhzmq","category":"economy-business","category_p":0.8299999833106995,"sentiment":"neutral","tone":0.18000000715255737,"political":0.10999999940395355}]}