{"schema":"hottub-news/story/v1","story":"st_vdied6ap6gr3e63wmfza","title":"美半導體龍頭應用材料攜手 Besi 強化先進封裝共建 AI 晶片生態","title_en":"US Semiconductor Leader Applied Materials Partners with Besi to Strengthen Advanced Packaging Co-Building AI Chip Ecosystem","outlets":1,"brief":null,"page":"https://hottub.news/stories/us-semiconductor-leader-applied-materials-partners-with-besi-to-vdied6ap6g","count":1,"items":[{"id":"n_vdied6ap6gr3e63wmfza","seq":1318046,"kind":"article","title":"美半導體龍頭應用材料攜手 Besi 強化先進封裝共建 AI 晶片生態","title_en":"US Semiconductor Leader Applied Materials Partners with Besi to Strengthen Advanced Packaging Co-Building AI Chip Ecosystem","url":"https://tw.stock.yahoo.com/news/%E7%BE%8E%E5%8D%8A%E5%B0%8E%E9%AB%94%E9%BE%8D%E9%A0%AD%E6%87%89%E7%94%A8%E6%9D%90%E6%96%99%E6%94%9C%E6%89%8B-besi-%E5%BC%B7%E5%8C%96%E5%85%88%E9%80%B2%E5%B0%81%E8%A3%9D%E5%85%B1%E5%BB%BA-ai-%E6%99%B6%E7%89%87%E7%94%9F%E6%85%8B-094031849.html","summary":"圖／示意圖商傳媒｜責任編輯／綜合外電報導美國半導體設備龍頭應用材料（Applied Materials）與半導體設備供應商 Be Semiconductor Industries（Besi）昨日（1日）宣布擴大策略合作夥伴關係。Besi 將正式加入應用材料耗資 50 億美元打造的先進半導體設備與製程技術研發中心 EPIC Center，共同推動半導體產業的技術創新。 兩家公司在 2020 年即啟動了一項聯合開發計畫，並在新加坡成立了卓越中心。該次合作成果斐然，共同開發出業界首個整合式晶粒到晶圓混合鍵合系統 Kinex。此次擴大的合作，將...","published":"2026-10-02T09:40:31Z","seen":"2026-10-02T10:09:40Z","lang":"zh","country":"TW","source":{"id":"kite-tw-news-yahoo-com-ae7227","name":"tw.news.yahoo.com","domain":"tw.news.yahoo.com"},"via":"kite-tw-news-yahoo-com-ae7227","entities":[{"id":"Q621610","name":"Applied Materials","type":"org"},{"id":"Q24340626","name":"Besi","type":"org"}],"story":"st_vdied6ap6gr3e63wmfza","category":"science-technology","category_p":0.9300000071525574,"sentiment":"positive","tone":0.7599999904632568,"political":0.03999999910593033}]}