{"schema":"hottub-news/story/v1","story":"st_w24pjtgthdsj2uwv7ifq","title":"三星高層：明年HBM將佔DRAM全球產能近30% 傳統DRAM供應承壓","title_en":"Samsung executive: Next year HBM will account for nearly 30% of global DRAM production capacity, traditional DRAM supply under pressure","outlets":6,"brief":null,"page":"https://hottub.news/stories/samsung-electronics-says-hbm-to-account-for-nearly-30-of-industry-dram-w24pjtgthd","count":7,"items":[{"id":"n_uvf5aldechyikdj3jctq","seq":806470,"kind":"article","title":"내년 D램 생산 HBM 비중 30%로 확대...치열해지는 삼성,하이닉스 경쟁","title_en":"Next year, HBM for DRAM production to expand to 30%...Samsung and Hynix's competition intensifies","url":"https://www.chosun.com/economy/tech_it/2026/09/30/3ZUOLKUQ4VE5LPDA2DLSF4PNYA","summary":"인공지능(AI)용 고대역폭 메모리(HBM) 생산이 늘면서 내년에는 세계 D램 웨이퍼(반도체 원판) 생산 능력의 약 30%가 HBM 생산에 투입될 전망이다. HBM에 더 많은 생산 라인을 배정하면서 PC·스마트폰 등에 쓰이는 일반 D램 공급은 줄어들 가능성이 커졌다. HBM3E까지 SK하이닉스가 앞섰던 HBM 시장에서는 HBM4를 앞세운 삼성전자의 추격도 빨라지고 있다.","published":"2026-09-30T02:12:26Z","seen":"2026-09-30T02:33:14Z","lang":"ko","country":"KR","source":{"id":"kite-chosun-com-8d8927","name":"chosun.com","domain":"chosun.com","outlet":{"wikidata":"Q483924","name":"The Chosun Ilbo","type":"newspaper","country":"KR","designations":["newspaper"]}},"via":"kite-chosun-com-8d8927","authors":["최인준 기자"],"entities":[{"id":"Q124989916","name":"Samsung","type":"org"},{"id":"Q370719","name":"SK Hynix","type":"org"}],"story":"st_w24pjtgthdsj2uwv7ifq","category":"economy-business","category_p":0.7200000286102295,"category2":"science-technology","sentiment":"neutral","tone":0.25,"political":0.1899999976158142},{"id":"n_47ukimkmnae4c6cg53bq","seq":806473,"kind":"article","title":"来年のDRAM、HBM向け3割に","title_en":"Next year's DRAM, 30% for HBM","url":"https://www.chosun.com/jp/economy-jp/2026/09/30/XUF3CGUD5FEGLPCH7QU6MEHXWY","summary":"人工知能（AI）向け高帯域幅メモリー（HBM）の生産が増える中、来年は世界のDRAMウェハー（半導体原板）生産能力の約30％がHBM生産に投入される見通しだ。HBMにより多くの生産ラインを割り当てることで、PCやスマートフォンなどに使われる汎用DRAMの供給は減る可能性が高まっている。HBM3EまでSKハイニックスが先行していたHBM市場では、HBM4を前面に出したサムスン電子の追撃も速まっている。","published":"2026-09-30T02:12:26Z","seen":"2026-09-30T02:33:14Z","lang":"ko","country":"KR","source":{"id":"kite-chosun-com-8d8927","name":"chosun.com","domain":"chosun.com","outlet":{"wikidata":"Q483924","name":"The Chosun Ilbo","type":"newspaper","country":"KR","designations":["newspaper"]}},"via":"kite-chosun-com-8d8927","authors":["チェ・インジュン 記者"],"story":"st_w24pjtgthdsj2uwv7ifq","category":"economy-business","category_p":0.47999998927116394,"category2":"science-technology","sentiment":"neutral","tone":0.25999999046325684,"political":0.14000000059604645},{"id":"n_x5gdeeccn6yu2qrbmpua","seq":796298,"kind":"article","title":"三星高層：明年HBM將佔DRAM全球產能近30% 傳統DRAM供應承壓","title_en":"Samsung executive: Next year HBM will account for nearly 30% of global DRAM production capacity, traditional DRAM supply under pressure","url":"https://news.cnyes.com/news/id/6618326","summary":"三星高層稱，明年HBM將佔全球DRAM晶圓總產能近30%，目前約20%。 HBM與傳統DRAM爭奪同一批產能，擴大HBM可能擠壓傳統DRAM供應。 TrendForce上修2027年HBM價格預期，混合平均售價估漲121%。","published":"2026-09-30T00:47:09Z","seen":"2026-09-30T00:54:44Z","lang":"zh","country":"TW","source":{"id":"kite-news-cnyes-com-887ba2","name":"news.cnyes.com","domain":"news.cnyes.com"},"via":"kite-news-cnyes-com-887ba2","topics":["歐亞股"],"authors":["鉅亨網編譯鍾詠翔 綜合外電"],"entities":[{"id":"Q124989916","name":"Samsung","type":"org"}],"image":"https://cimg.cnyes.cool/static/rss/default/m/06.jpg","story":"st_w24pjtgthdsj2uwv7ifq","category":"economy-business","category_p":0.5299999713897705,"category2":"science-technology","sentiment":"neutral","tone":0.12999999523162842,"political":0.10000000149011612},{"id":"n_y7afvb5cis4ysrzwj3qq","seq":603560,"kind":"article","title":"Samsung Electronics says HBM to account for nearly 30% of industry DRAM capacity next year","url":"https://www.brecorder.com/news/40441772/samsung-electronics-says-hbm-to-account-for-nearly-30-of-industry-dram-capacity-next-year","summary":"SEOUL: A Samsung Electronics executive said on Tuesday that high-bandwidth memory (HBM) is expected to account for nearly 30% of Dynamic Random-Access Memory (DRAM) chipmakers’ total wafer capacity next year, up from about 20% currently. Samsung Electronics Executive Vice President Kim Taewoo said HBM and standard DRAM compete for the same wafer capacity, meaning expanding HBM output could constrain standard DRAM supply. HBM is a crucial component for AI computing…","published":"2026-09-29T06:39:04Z","seen":"2026-09-29T07:12:27Z","lang":"en","country":"PK","source":{"id":"kite-brecorder-com-aeb501","name":"brecorder.com","domain":"brecorder.com","outlet":{"wikidata":"Q59705","name":"Business Recorder","type":"newspaper","designations":["newspaper"]}},"via":"kite-brecorder-com-aeb501","topics":["markets"],"authors":["author"],"entities":[{"id":"Q20718","name":"Samsung Electronics","type":"org"}],"image":"https://i.brecorder.com/thumbnail/2026/09/29113850e00cd3c.webp","story":"st_w24pjtgthdsj2uwv7ifq","category":"science-technology","category_p":0.5199999809265137,"category2":"economy-business","sentiment":"positive","tone":0.46000000834465027,"political":0.05000000074505806},{"id":"n_a6gq2ryef7ob2lnrsgha","seq":586927,"kind":"article","title":"Samsung Electronics: Samsung Predicts HBM Will Dominate 30% of DRAM Market by 2027, ETTelecom","url":"https://telecom.economictimes.indiatimes.com/news/devices/hbm-may-account-for-nearly-30-of-industry-wide-dram-capacity-next-year-says-samsung-report/134554042","published":"2026-09-29T05:43:18Z","seen":"2026-09-29T05:43:18Z","lang":"en","source":{"id":"indiatimes.com","name":"indiatimes.com","domain":"indiatimes.com","outlet":{"wikidata":"Q113974698","name":"Indiatimes","type":"other","country":"IN","designations":["news media"]}},"via":"gdelt-gkg-english","topics":["economy"],"authors":["www.ETTelecom.com"],"entities":[{"id":"Q20718","name":"Samsung Electronics","type":"org"}],"story":"st_w24pjtgthdsj2uwv7ifq","category":"economy-business","category_p":0.5299999713897705,"category2":"science-technology","sentiment":"neutral","tone":0.09000000357627869,"political":0.03999999910593033},{"id":"n_pe53jyvc57z47puw2fnq","seq":560040,"kind":"article","title":"三星高管预计明年 HBM 占 DRAM 行业总产能近 30%，高于目前的 20%","title_en":"Samsung executive predicts next year's HBM will account for nearly 30% of DRAM industry total capacity, higher than current 20%","url":"https://www.ithome.com/1/008/124.htm","summary":"IT之家 9 月 29 日消息，据路透社报道，三星电子一位高管表示，高带宽内存（HBM）预计明年将占到各家 DRAM 芯片厂商全部晶圆产能的近 30%，高于目前约 20% 的水平。 三星电子（SSNLF）执行副总裁金泰宇（Kim Taewoo）称，HBM 与普通 DRAM 争夺晶圆产能。这就意味着扩大 HBM 的产出规模，有可能会挤压标准 DRAM 的供给。 据IT之家了解，HBM 是 AI 算力当中的关键元器件，由多层存储芯片垂直堆叠而成，可以让处理器以极高的速度读取海量数据。该市场目前主要由韩国的 SK 海力士、三星电子以及美国美光科技三家企业主导。","published":"2026-09-29T02:00:33Z","seen":"2026-09-29T02:07:36Z","lang":"zh","country":"CN","source":{"id":"kite-ithome-com-f1cdd0","name":"ithome.com","domain":"ithome.com","outlet":{"wikidata":"Q28413779","name":"IThome","type":"website","country":"CN","designations":["website"]}},"via":"kite-ithome-com-f1cdd0","entities":[{"id":"Q124989916","name":"Samsung","type":"org"}],"story":"st_w24pjtgthdsj2uwv7ifq","category":"economy-business","category_p":0.5299999713897705,"category2":"science-technology","sentiment":"neutral","tone":0.28999999165534973,"political":0.10000000149011612},{"id":"n_w24pjtgthdsj2uwv7ifq","seq":557629,"kind":"article","title":"Samsung Electronics says HBM to account for nearly 30% of industry DRAM capacity next year","url":"https://www.channelnewsasia.com/business/samsung-electronics-says-hbm-account-nearly-30-industry-dram-capacity-next-year-6417091","published":"2026-09-29T01:07:39Z","seen":"2026-09-29T01:41:34Z","lang":"en","country":"SG","source":{"id":"cna","name":"CNA (Channel NewsAsia)","domain":"channelnewsasia.com","outlet":{"wikidata":"Q40238","name":"CNA","type":"other","country":"SG","designations":["news broadcasting","specialty channel"]}},"via":"cna","topics":["business"],"entities":[{"id":"Q20718","name":"Samsung Electronics","type":"org"},{"id":"Q18028670","name":"LRP5","type":"other"},{"id":"Q189396","name":"dynamic random-access memory","type":"other"}],"image":"https://dam.mediacorp.sg/image/upload/s--FaxOwIJ0--/fl_relative,g_south_east,l_mediacorp:cna:watermark:2024-04:reuters_1,w_0.1/f_auto,q_auto/c_fill,g_auto,h_468,w_830/v1/one-cms/core/2026-09-29T010343Z_1_LYNXMPEM8S03C_RTROPTP_3_SOUTHKOREA-CHIPS.JPG?itok=FTAfbhnN","story":"st_w24pjtgthdsj2uwv7ifq","category":"science-technology","category_p":0.5199999809265137,"category2":"economy-business","sentiment":"positive","tone":0.46000000834465027,"political":0.05000000074505806}]}