Yingcai and Best Semiconductor expand cooperation to develop next-generation AI chip packaging technology

應材與貝思半導體擴大合作 開發新一代AI晶片封裝技術

2 reports from 2 outlets in 1 language · first reported 2026-10-02 02:43 UTC · updated 2026-10-02 03:03 UTC · JSON

Reports

1. 應材與貝思半導體擴大合作 開發新一代AI晶片封裝技術Yingcai and Best Semiconductor expand cooperation to develop next-generation AI chip packaging technologynews.cnyes.com · zh · 2026-10-02 03:03 UTC
2. 應材與貝思擴大合作，聚焦3D IC擴展、邏輯與記憶體整合及光子應用Ying Cai and Best expand cooperation, focusing on 3D IC expansion, logic and memory integration and photonic applicationstw.news.yahoo.com · zh · 2026-10-02 02:43 UTC